Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6573606 | Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect | Carlos J. Sambucetti, Xiaomeng Chen, Soon-Cheon Seo, Birenda Nath Agarwala, Chao-Kun Hu +1 more | 2003-06-03 |