Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6573170 | Process for multilayer wiring connections and bonding pad adhesion to dielectric in a semiconductor integrated circuit device | Takashi Aoyagi, Hirotaka Kobayashi, Yuji Hara | 2003-06-03 |
| 6562695 | Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processing | Norio Suzuki, Hiroyuki Ichizoe, Masayuki Kojima, Keiji Okamoto, Shinichi Horibe +6 more | 2003-05-13 |
| 6503794 | Semiconductor integrated circuit device and method for manufacturing the same | Kozo Watanabe, Masahiro Moniwa, Syunichi Hashimoto, Masayuki Kojima, Kiyonori Ohyu +2 more | 2003-01-07 |