Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6573170 | Process for multilayer wiring connections and bonding pad adhesion to dielectric in a semiconductor integrated circuit device | Takashi Aoyagi, Atsushi Ogishima, Yuji Hara | 2003-06-03 |