Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6662443 | Method of fabricating a substrate with a via connection | William T. Chou, Michael G. Lee, Michael G. Peters, Wen-chou Vincent Wang | 2003-12-16 |
| 6611635 | Opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2003-08-26 |
| 6579474 | Conductive composition | Mark Thomas McCormack, Hunt Hang Jiang, Albert W. Chan, Yasuhito Takahashi | 2003-06-17 |
| 6572780 | Methods for fabricating flexible circuit structures | Mark Thomas McCormack, James J. Roman, Lei Zhang | 2003-06-03 |
| 6544430 | Methods for detaching a layer from a substrate | Mark Thomas McCormack, James J. Roman, Lei Zhang | 2003-04-08 |
| 6509529 | Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch | Sundar M. Kamath, David Chazan, Jan Strandberg | 2003-01-21 |