Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6509529 | Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch | David Chazan, Jan Strandberg, Solomon I. Beilin | 2003-01-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6509529 | Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch | David Chazan, Jan Strandberg, Solomon I. Beilin | 2003-01-21 |