Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6662443 | Method of fabricating a substrate with a via connection | William T. Chou, Solomon I. Beilin, Michael G. Peters, Wen-chou Vincent Wang | 2003-12-16 |
| 6611635 | Opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, William T. Chou, Solomon I. Beilin +3 more | 2003-08-26 |
| 6592943 | Stencil and method for depositing solder | Albert W. Chan, Theresa M. Larson | 2003-07-15 |
| 6543674 | Multilayer interconnection and method | Connie M. Wong, Wen-chou Vincent Wang | 2003-04-08 |
| 6518096 | Interconnect assembly and Z-connection method for fine pitch substrates | Albert W. Chan | 2003-02-11 |