Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6662443 | Method of fabricating a substrate with a via connection | William T. Chou, Solomon I. Beilin, Michael G. Lee, Wen-chou Vincent Wang | 2003-12-16 |
| 6521530 | Composite interposer and method for producing a composite interposer | Mark Thomas McCormack, Aris Bernales | 2003-02-18 |