Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6548396 | Method of producing an interconnect structure for an integrated circuit | Mehul Naik | 2003-04-15 |
| 6514671 | Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics | Suketu Arun Parikh, Mehul Naik, H. Peter W. Hey | 2003-02-04 |