Issued Patents 2003
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6665623 | Method and apparatus for optimizing downstream uniformity | Alexander J. Pasadyn | 2003-12-16 |
| 6664013 | Methods of characterizing device performance based upon the duration of an endpointed photoresist develop process, and system for accomplishing same | Joyce S. Oey Hewett | 2003-12-16 |
| 6650955 | Method and apparatus for determining a sampling plan based on process and equipment fingerprinting | Thomas J. Sonderman, Alexander J. Pasadyn | 2003-11-18 |
| 6622061 | Method and apparatus for run-to-run controlling of overlay registration | Anthony J. Toprac, Richard D. Edwards | 2003-09-16 |
| 6615098 | Method and apparatus for controlling a tool using a baseline control script | Alexander J. Pasadyn, Anthony J. Toprac, Joyce S. Oey Hewett, Anastasia Oshelski Peterson, Thomas J. Sonderman +1 more | 2003-09-02 |
| 6610550 | Method and apparatus for correlating error model with defect data | Alexander J. Pasadyn | 2003-08-26 |
| 6607926 | Method and apparatus for performing run-to-run control in a batch manufacturing environment | Anthony J. Toprac, William J. Campbell | 2003-08-19 |
| 6605479 | Method of using damaged areas of a wafer for process qualifications and experiments, and system for accomplishing same | Alexander J. Pasadyn | 2003-08-12 |
| 6589875 | Method of selectively processing wafer edge regions to increase wafer uniformity, and system for accomplishing same | Alexander J. Pasadyn | 2003-07-08 |
| 6577914 | Method and apparatus for dynamic model building based on machine disturbances for run-to-run control of semiconductor devices | — | 2003-06-10 |
| 6576385 | Method of varying stepper exposure dose to compensate for across-wafer variations in photoresist thickness | Joyce S. Oey Hewett, Alexander J. Pasadyn | 2003-06-10 |
| 6569692 | Automated method of controlling photoresist develop time to control critical dimensions, and system for accomplishing same | Joyce S. Oey Hewett | 2003-05-27 |
| 6535774 | Incorporation of critical dimension measurements as disturbances to lithography overlay run to run controller | Anthony J. Toprac | 2003-03-18 |
| 6528331 | Method for identifying and controlling impact of ambient conditions on photolithography processes | Anthony J. Toprac | 2003-03-04 |