Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6441475 | Chip scale surface mount package for semiconductor device and process of fabricating the same | Felix Zandman, Yueh-Se Ho | 2002-08-27 |
| 6392290 | Vertical structure for semiconductor wafer-level chip scale packages | Yueh-Se Ho, Lee Luo, Chang-Sheng Chen, Eddy Tjhia, Bosco Lan +2 more | 2002-05-21 |