Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6392290 | Vertical structure for semiconductor wafer-level chip scale packages | Y. Mohammed Kasem, Yueh-Se Ho, Lee Luo, Eddy Tjhia, Bosco Lan +2 more | 2002-05-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6392290 | Vertical structure for semiconductor wafer-level chip scale packages | Y. Mohammed Kasem, Yueh-Se Ho, Lee Luo, Eddy Tjhia, Bosco Lan +2 more | 2002-05-21 |