Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D466873 | Semiconductor chip package | Yehja Mohammed Kasem, Frank Kuo | 2002-12-10 |
| 6392290 | Vertical structure for semiconductor wafer-level chip scale packages | Y. Mohammed Kasem, Yueh-Se Ho, Lee Luo, Chang-Sheng Chen, Bosco Lan +2 more | 2002-05-21 |