Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451677 | Plasma-enhanced chemical vapor deposition of a nucleation layer in a tungsten metallization process | Jiong-Ping Lu, Boyang Lin | 2002-09-17 |
| 6424040 | Integration of fluorinated dielectrics in multi-level metallizations | Somnath Nag, Changming Jin, Guoqiang Xing | 2002-07-23 |
| 6334249 | Cavity-filling method for reducing surface topography and roughness | — | 2002-01-01 |