Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495813 | Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process | Bii-Cheng Chang, Sheng-Liang Pan, Kuo-Liang Lu | 2002-12-17 |
| 6486054 | Method to achieve robust solder bump height | Hsiu-Mei Yu, Li-Hsin Tseng, Kuang-Peng Lin, Ta-Yang Lin | 2002-11-26 |
| 6482669 | Colors only process to reduce package yield loss | Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2002-11-19 |
| 6426281 | Method to form bump in bumping technology | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Fu-Jier Fan, Kuo-Wei Lin, Yen-Ming Chen, Cheng-Yu Chu, Shih-Jane Lin +1 more | 2002-04-16 |