Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6482669 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2002-11-19 |
| 6468704 | Method for improved photomask alignment after epitaxial process through 90° orientation change | Chi-Hung Liao, Yih-Ann Lin, Sheng-Liang Pan, Kuo-Liang Lu, Yu-Hsi Wang | 2002-10-22 |
| 6426281 | Method to form bump in bumping technology | Kuo-Wei Lin, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Yen-Ming Chen, Kuo-Wei Lin, Fu-Jier Fan, Yang-Tung Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Fu-Jier Fan, Kuo-Wei Lin, Yen-Ming Chen, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2002-04-16 |
| 6338976 | Method for forming optoelectronic microelectronic fabrication with attenuated bond pad corrosion | Chieh-Chuan Huang, Shun-Liang Hsu | 2002-01-15 |