Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486054 | Method to achieve robust solder bump height | Yang-Tung Fan, Li-Hsin Tseng, Kuang-Peng Lin, Ta-Yang Lin | 2002-11-26 |
HY
Hsiu-Mei Yu
Overall (2002): #202,967 of 266,432Top 80%
1
Patents 2002