Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486054 | Method to achieve robust solder bump height | Yang-Tung Fan, Hsiu-Mei Yu, Li-Hsin Tseng, Ta-Yang Lin | 2002-11-26 |
| 6472235 | Apparatus and method for preparing backside-ground wafers for testing | Hung-Jen TSAI, Hsien-Tsong Liu | 2002-10-29 |