Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479881 | Low temperature process for forming intermetal gap-filling insulating layers in silicon wafer integrated circuitry | Ying-Lang Wang, Chun-Ching Tsan, Hung-Ju Chien | 2002-11-12 |
| 6395635 | Reduction of tungsten damascene residue | Ying-Lang Wang | 2002-05-28 |