Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6461494 | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot | Kenneth C. Haugan, Harry J. Geyer, Robert W. Berner | 2002-10-08 |
| 6334937 | Apparatus for high deposition rate solder electroplating on a microelectronic workpiece | Scot Conrady, Thomas Ritzdorf | 2002-01-01 |