Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6461494 | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot | Robert W. Batz, Jr., Harry J. Geyer, Robert W. Berner | 2002-10-08 |