Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6478834 | Slurry for chemical mechanical polishing | Tomoko Wake, Tetsuyuki Itakura, Shin Sakurai, Kenichi Aoyagi | 2002-11-12 |
| 6443807 | Polishing process for use in method of fabricating semiconductor device | Tetsuya Sakai | 2002-09-03 |
| 6436811 | Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry | Tomoko Wake | 2002-08-20 |
| 6428405 | Abrasive pad and polishing method | — | 2002-08-06 |
| 6368981 | Method of manufacturing semiconductor device and chemical mechanical polishing apparatus | Kazumi Sugai | 2002-04-09 |
| 6350186 | Apparatus and method for chemical mechanical polishing | — | 2002-02-26 |