Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6478834 | Slurry for chemical mechanical polishing | Yasuaki Tsuchiya, Tetsuyuki Itakura, Shin Sakurai, Kenichi Aoyagi | 2002-11-12 |
| 6436811 | Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry | Yasuaki Tsuchiya | 2002-08-20 |