Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376049 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole | Motoo Asai, Kenichi Shimada, Kouta Noda, Takashi Kariya | 2002-04-23 |
| 6376052 | Multilayer printed wiring board and its production process, resin composition for filling through-hole | Motoo Asai, Ken Shimada, Kouta Noda, Takashi Kariya | 2002-04-23 |