Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440542 | Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same | — | 2002-08-27 |
| 6407345 | Printed circuit board and method of production thereof | Naohiro Hirose, Yoji Mori | 2002-06-18 |
| 6376049 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole | Motoo Asai, Kenichi Shimada, Kouta Noda, Hiroshi Segawa | 2002-04-23 |
| 6376052 | Multilayer printed wiring board and its production process, resin composition for filling through-hole | Motoo Asai, Ken Shimada, Kouta Noda, Hiroshi Segawa | 2002-04-23 |