Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376052 | Multilayer printed wiring board and its production process, resin composition for filling through-hole | Motoo Asai, Kouta Noda, Takashi Kariya, Hiroshi Segawa | 2002-04-23 |