Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6490170 | Package substrate | Yoji Mori | 2002-12-03 |
| 6487088 | Package substrate | Yoji Mori | 2002-11-26 |
| 6451932 | Resin composites and method for producing the same | Dong Wang | 2002-09-17 |
| 6411519 | Package substrate | Yoji Mori | 2002-06-25 |
| 6392898 | Package substrate | Yoji Mori | 2002-05-21 |
| 6384344 | Circuit board for mounting electronic parts | Yoichiro Kawamura, Yoji Mori | 2002-05-07 |
| 6376052 | Multilayer printed wiring board and its production process, resin composition for filling through-hole | Ken Shimada, Kouta Noda, Takashi Kariya, Hiroshi Segawa | 2002-04-23 |
| 6376049 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole | Kenichi Shimada, Kouta Noda, Takashi Kariya, Hiroshi Segawa | 2002-04-23 |
| 6365843 | Multilayer printed wiring board | Seiji Shirai, Kenichi Shimada | 2002-04-02 |