JB

John M. Boyd

Lam Research: 6 patents #2 of 158Top 2%
📍 Woodlawn, CA: #1 of 4 inventorsTop 25%
Overall (2002): #6,020 of 266,432Top 3%
6
Patents 2002

Issued Patents 2002

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
6495464 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool Michael S. Lacy 2002-12-17
6488568 Optical view port for chemical mechanical planarization endpoint detection Randolph Treur, Stephan Wolf 2002-12-03
6475332 Interlocking chemical mechanical polishing system Katgenahalli Y. Ramanujam, Sridharan Srivatsan, Xuyen Pham 2002-11-05
6471566 Sacrificial retaining ring CMP system and methods for implementing the same Katrina Mikhaylich 2002-10-29
6435952 Apparatus and method for qualifying a chemical mechanical planarization process Katrina Mikhaylich, Mike Ravkin 2002-08-20
6358118 Field controlled polishing apparatus and method Robert G. Boehm, Jr. 2002-03-19