Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455331 | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Yeeling L. Lee +3 more | 2002-09-24 |
| 6448169 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Laertis Economikos, Paul F. Findeis, Bouwe W. Leenstra, Arthur G. Merryman +4 more | 2002-09-10 |