Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455331 | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2002-09-24 |