Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6461895 | Process for making active interposer for high performance packaging applications | Chunlin Liang, Larry E. Mosley | 2002-10-08 |
| 6461954 | Method and an apparatus for forming an under bump metallization structure | Jian Li, Sridhar Balakrishnan | 2002-10-08 |
| 6423570 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Quat Vu | 2002-07-23 |
| 6365962 | Flip-chip on flex for high performance packaging applications | Chunlin Liang, Larry E. Mosley | 2002-04-02 |