Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6461954 | Method and an apparatus for forming an under bump metallization structure | Xiao-Chun Mu, Sridhar Balakrishnan | 2002-10-08 |
| 6376919 | Circuit edit interconnect structure through the backside of an integrated circuit die | Paul Winer, Adam J. DeGrush, Steven P. Maher | 2002-04-23 |