Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376919 | Circuit edit interconnect structure through the backside of an integrated circuit die | Jian Li, Paul Winer, Adam J. DeGrush | 2002-04-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376919 | Circuit edit interconnect structure through the backside of an integrated circuit die | Jian Li, Paul Winer, Adam J. DeGrush | 2002-04-23 |