Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6423570 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Xiao-Chun Mu | 2002-07-23 |
| 6388328 | Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system | Brian S. Doyle, Leopold Yau | 2002-05-14 |