LY

Leopold Yau

IN Intel: 1 patents #540 of 1,614Top 35%
📍 Portland, OR: #221 of 661 inventorsTop 35%
🗺 Oregon: #630 of 2,069 inventorsTop 35%
Overall (2002): #167,333 of 266,432Top 65%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6388328 Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system Brian S. Doyle, Quat Vu 2002-05-14