Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475072 | Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP) | Donald F. Canaperi, Jack O. Chu, Guy M. Cohen, John A. Ott, Michael F. Lofaro | 2002-11-05 |