Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475072 | Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP) | Donald F. Canaperi, Jack O. Chu, Guy M. Cohen, Lijuan Huang, Michael F. Lofaro | 2002-11-05 |
| 6350993 | High speed composite p-channel Si/SiGe heterostructure for field effect devices | Jack O. Chu, Richard Hammond, Khalid EzzEldin Ismail, Steven J. Koester, Patricia M. Mooney | 2002-02-26 |