Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465338 | Method of planarizing die solder balls by employing a die's weight | Sarathy Rajagopalan, Zafer Kutlu | 2002-10-15 |
| 6452116 | Use of blind vias for soldered interconnections between substrates and printed wiring boards | Gregg J. Armezzani, Jeffrey S. Perkins, John J. Pessarchick | 2002-09-17 |
| 6431432 | Method for attaching solderballs by selectively oxidizing traces | John McCormick | 2002-08-13 |
| 6433565 | Test fixture for flip chip ball grid array circuits | Maniam Alagaratnam, Sunil A. Patel | 2002-08-13 |
| 6335491 | Interposer for semiconductor package assembly | Maniam Alagaratnam, Sunil A. Patel | 2002-01-01 |