Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472762 | Enhanced laminate flipchip package using a high CTE heatspreader | — | 2002-10-29 |
| 6465338 | Method of planarizing die solder balls by employing a die's weight | Sarathy Rajagopalan, Kishor Desai | 2002-10-15 |