Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465338 | Method of planarizing die solder balls by employing a die's weight | Kishor Desai, Zafer Kutlu | 2002-10-15 |
| 6441499 | Thin form factor flip chip ball grid array | Kumar Nagarajan | 2002-08-27 |