Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6466038 | Non-isothermal electromigration testing of microelectronic packaging interconnects | Senol Pekin | 2002-10-15 |
| 6433565 | Test fixture for flip chip ball grid array circuits | Kishor Desai, Maniam Alagaratnam | 2002-08-13 |
| 6335491 | Interposer for semiconductor package assembly | Maniam Alagaratnam, Kishor Desai | 2002-01-01 |