Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6466038 | Non-isothermal electromigration testing of microelectronic packaging interconnects | Sunil A. Patel | 2002-10-15 |
| 6403399 | Method of rapid wafer bumping | Kang-rong Chiang | 2002-06-11 |