Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495914 | Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate | Kenji Sekine, Hiroji Yamada, Matsuo Yamasaki, Osamu Kagaya | 2002-12-17 |
| 6492195 | Method of thinning a semiconductor substrate using a perforated support substrate | Masaki Nakanishi, Susumu Sorimachi, Hiroji Yamada, Kikuo Fukushima | 2002-12-10 |
| 6489680 | Semiconductor device | Iwamichi Kohjiro, Yasuhiro Nunogawa, Sakae Kikuchi, Shizuo Kondo, Tetsuaki Adachi +3 more | 2002-12-03 |
| 6461927 | Semiconductor device and method of producing the same | Kazuhiro Mochizuki, Tohru Oka, Isao Ohbu | 2002-10-08 |
| 6337355 | Two-pack urethane foam composition | Tatsuya Wakamori, Masahito Mori, Mutsuhisa Miyamoto | 2002-01-08 |