Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495914 | Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate | Kenji Sekine, Matsuo Yamasaki, Osamu Kagaya, Kiichi Yamashita | 2002-12-17 |
| 6492195 | Method of thinning a semiconductor substrate using a perforated support substrate | Masaki Nakanishi, Susumu Sorimachi, Kiichi Yamashita, Kikuo Fukushima | 2002-12-10 |