Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495914 | Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate | Kenji Sekine, Hiroji Yamada, Osamu Kagaya, Kiichi Yamashita | 2002-12-17 |