Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492195 | Method of thinning a semiconductor substrate using a perforated support substrate | Masaki Nakanishi, Kiichi Yamashita, Hiroji Yamada, Kikuo Fukushima | 2002-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492195 | Method of thinning a semiconductor substrate using a perforated support substrate | Masaki Nakanishi, Kiichi Yamashita, Hiroji Yamada, Kikuo Fukushima | 2002-12-10 |