Issued Patents 2002
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495004 | Substrate plating apparatus | Fumio Kuriyama, Akihisa Hongo | 2002-12-17 |
| 6486413 | Substrate coated with a conductive layer and manufacturing method thereof | — | 2002-11-26 |
| 6458694 | High energy sputtering method for forming interconnects | Takao Kato, Kuniaki Horie, Yuji Araki | 2002-10-01 |
| 6455475 | Sliding member and process for producing the same | — | 2002-09-24 |
| 6432257 | Dresser for polishing cloth and method for manufacturing such dresser and polishing apparatus | Hiroshi Nagasaka, Momoko Kakutani, Kunio Tateishi, Takashi Yoda | 2002-08-13 |
| 6391775 | Method of forming embedded copper interconnections and embedded copper interconnection structure | Hiroaki Inoue | 2002-05-21 |
| 6387182 | Apparatus and method for processing substrate | Kuniaki Horie, Yukio Fukunaga, Tsutomu Nakada, Masahito Abe, Mitsunao Shibasaki +3 more | 2002-05-14 |
| 6365017 | Substrate plating device | Akihisa Hongo, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki +3 more | 2002-04-02 |