Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365502 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Mehrdad M. Moslehi, Boris Relja, Randhir Bubber, Lino Velo +3 more | 2002-04-02 |