Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6461675 | Method for forming a copper film on a substrate | Ajit Paranjpe, Mehrdad M. Moslehi, Thomas R. Omstead, David Campbell, Zeming Liu +1 more | 2002-10-08 |
| 6365502 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Mehrdad M. Moslehi, Boris Relja, Randhir Bubber, Thomas R. Omstead +3 more | 2002-04-02 |