Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5606196 | High-frequency, high-density semiconductor chip package with screening bonding wires | Hai-Young Lee, Chan-Min Han | 1997-02-25 |
KL
Kyung S. Lee
Overall (1997): #115,618 of 185,788Top 65%
1
Patents 1997