Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5606196 | High-frequency, high-density semiconductor chip package with screening bonding wires | Hai-Young Lee, Kyung S. Lee | 1997-02-25 |
CH
Chan-Min Han
Overall (1997): #168,434 of 185,788Top 95%
1
Patents 1997